8800WI

Wafer Bump 3D Vision Inspection

  • Conduct with PASS Buffer when REWORK Part with Multiple NGs
  • Function to start manufacturing with the REWORK Parts during INSPECTION ATM Check
  • Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection
  • AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER
  • Users can output and monitor the designated DATA by Using the self-developed SPC SW, such as data, defective images, and charts.
  • PEMTRON SMARTRON server system allows user to view and control each device through one operation PC to monitoring the operational status and SPC DATA of all equipment
  • Using 3D Inspection Methodology to process the BUMP Inspection
  • Reduce resources to check and debug the fault defects based on the outstanding inspection precision

Video

Key Feature

Wafer Bump 2D + 3D Inspection
Wafer Size: 8”+ 12”
Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection

Structure

Inspection bump

Inspection

Technical Data

Range General Specification
Camera 12Mega (12um)
FOV 49 x 36mm
Loadport 1ea
Wafer size 8",12"
Carrier 200mm 300mm FOUP
WPH ≧40 WPH (2D & 3D scan for 12")
(for 12"&8" Wafer size) ≧50 WPH (2D & 3D scan for 12")
lonizer Measurement point : defined by user
Electric Supply 220v 10%(60Hz)
Communication Ether-Net or pulse
User Interface GUI - Touch Screen or Mouse(user requirement)
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