8800WI
Wafer Bump 3D Vision Inspection
- Conduct with PASS Buffer when REWORK Part with Multiple NGs
- Function to start manufacturing with the REWORK Parts during INSPECTION ATM Check
- Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection
- AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER
- Users can output and monitor the designated DATA by Using the self-developed SPC SW, such as data, defective images, and charts.
- PEMTRON SMARTRON server system allows user to view and control each device through one operation PC to monitoring the operational status and SPC DATA of all equipment
- Using 3D Inspection Methodology to process the BUMP Inspection
- Reduce resources to check and debug the fault defects based on the outstanding inspection precision
Video
Key Feature
Wafer Bump 2D + 3D Inspection
Wafer Size: 8”+ 12”
Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection
Structure
Inspection bump
Inspection
Technical Data
| Range | General Specification |
|---|---|
| Camera | 12Mega (12um) |
| FOV | 49 x 36mm |
| Loadport | 1ea |
| Wafer size | 8",12" |
| Carrier | 200mm 300mm FOUP |
| WPH | ≧40 WPH (2D & 3D scan for 12") |
| (for 12"&8" Wafer size) | ≧50 WPH (2D & 3D scan for 12") |
| lonizer | Measurement point : defined by user |
| Electric Supply | 220v 10%(60Hz) |
| Communication | Ether-Net or pulse |
| User Interface | GUI - Touch Screen or Mouse(user requirement) |
CONTACT