APOLLON
Automatic Visual Inspection
- TRAY BASED INSPECTION
It accommodates a variety of package handled by the tray such as BGA,LGA,GFN,QFP,CSP,SOP, etc - 3D double loading inspection
It does not only identify OK and NG, it also inspects double-loaded material More accurate double loading inspection is performed by 3D inspection method compared to laser method. - Accurate SPC process management system
3D image storage and NG review function without tray handling in the eequipment
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Vision Technologies
TRAY-BASED VISION SOLUTION
Bottom Vision Inspection
Top Vision Inspection
4Sides Vision Inspection
PACKAGE Inspection
APOLLON is a double-sided automatic vision inspection for memory composed of PEMTRON's breakthrough technology.
The APOLLON vision machine provides unprecedented inspection capability at unseen accuracy.
Reliable and Highest Accuracy
Reliable 3D inspection of all objects: ball, leads, passive devices, solder pads, etc.
3D scan of surfaces to detect and measure dents and bulges
Reliable and accurate part height measurement
4way Side Vision Inspection
TOP/BOTTOM 5side Inspection
High speed device is available for side inspection depending on production requirements.
Advanced 3D + 2D Inspection
Diversification of detection types with 3D detection function
With automatic Algorithm, positive/non-determination and classification can be made on the facility
High-resolution capability
Large FOV with increased homogeneity
Color inspection to find defects like discoloration shields, exposed bond wire, plating defects, etc.
Inspection ability to detect micro cracks
Color review imaging
TOP VISION INSPECTION Comprehensive 3D+2D Inspection
Inspection on top surface of any packages for various marking defects.
Heat spreader Scratch and PCB surface of various packages.
Inspection on the components mounted on PCB.
Inspection on the underlying exposed metal.
BOTTOM VISION INSPECTION
Inspection for Bottom view for wide range of package such as QFP, TSOP, BGA,CSP, and Side Inspection for leadless devices
BGA Package Inspection
Warpage, Ball Height, Coplanarity, Offset, Ball Width, Ball Quallity, Grid-to-Package Offset, Pitch, Contrast, Body Width Height, Ball Presence/Absence, Component Height
Leadless Packages Inspection
Position, Pitch, Width, Length, Pad Spacing, Distance to Edge, Edge Straightness
Body width/Body Height, Edge Parallelism, Edge Orthogonality, Edge Parallelism/Orthogonality
Leadless Packages Inspection
Lead Coplanarity, Body Standoff, Lead Offset/Skew, Lead Pitch, Lead Width, Terminal Dimension, Foot Angle, Lead Sweep.
TRAY BASED INSPECTION
It accommodates a variety of package handled by the tray such as BGA,LGA,GFN,QFP,CSP,SOP, etc
High-speed inspection
Convenience for workers
Automatic sorting, re-inspection function. fast conversion time
3D double loading inspection
It does not only identify OK and NG, it also inspects double-loaded material
More accurate double loading inspection is performed by 3D inspection method compared to laser method.
Accurate SPC process management system
3D image storage and NG review function without tray handling in the equipment.
Capable of management of various statistical process data with basis of Accurate measurement
result extracted by SPC.
Defects can be confirmed through defect history,
image confirmation and It is possible to track and map the location of the badly sorted
JEDEC tray from the SPC data.
Increasing production yield rate.
checking process status check,
Identifying cause of defect
Product quality improvement,
At-a-glance interface for Operator
Data collection in Real time,
3D NG Image save &NG Review
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