Delta 6
CONFORMAL COATING, DAM & FILL, ENCAPSULATION & GLOB TOP, GASKETING, POTTING, SURFACE MOUNT ADHESIVE / SOLDER PASTE, THERMAL INTERFACE MATERIALS, UNDERFILL
The Delta 6 is a new, reimagined flexible robotic conformal coating/dispensing system that is ideal for selective coating, potting, bead, and meter-mix dispensing applications. The Delta 6 features a robust overhead three-axis motion platform suitable for inline or batch operations.
While maintaining the preferred features of previous workcells, the Delta 6 has been designed with a slimmer footprint, improved structural and gantry rigidity for robustness, and easier access.
The Delta 6 has many options and integrated features including:
- Robotic system repeatability of 25 microns
- Patented servo-controlled optional four-axis motion featuring valve tilt and rotate
- Closed loop process control throughout gantry system
- Multiple dispensing applications or materials in one cell
- Onboard PC for unlimited program storage
- Exclusive PathMaster® programming environment
Video
APPLICATIONS
Conformal Coating
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Dam & Fill
A two-step process of first dispensing a high viscosity fluid around the perimeter of a device or electronic circuitry, and then dispensing a low viscosity fluid within the perimeter to fully encase the components. The dam can be applied as a single or multi-layer bead depending on the target fill height required.
Encapsulation & Glob Top
Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.
Gasketing
Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other designs.
Potting
The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.
Surface Mount Adhesive / Solder Paste
Surface Mount Adhesive (SMA), solder paste, and filled epoxies require accurate deposits to adhere SMT components to a PCB surface. Consistent dot or bead profiles are critical for bonding a broad range of components with a growing emphasis on miniaturization that is achievable with jetting valves or auger pumps.
Thermal Interface Materials
A thermal interface material ("TIM") fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Underfill
The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.
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