SOiETON
SOiETON

SOiETON

Intelligent solder paste management cabinet

The intelligent solder paste management cabinet is a device that integrates automatic disordered refrigeration, automatic temperature recovery, automatic stirring, data traceability and other functions. It can be connected with MES/ERP and other systems for real-time data interaction.

  • 1Independent intellectual property rights.
  • IC card/fingerprint login, personnel authority control.
  • Automatic code scanning - automatic refrigeration - solder paste reservation - automatic temperature recovery - automatic stirring.
  • There is no limit to the type of solder paste, first in, first out, half a bottle of solder paste is automatically discharged first.
  • Solder pastes and wire body, product correlation, exportable reports.
  • 365 days, 24-hour monitoring, low inventory warning.
  • Real-time inventory, full traceability, and data cloud management.
  • Can be connected with MES/ERP and other systems.

Viedo

TRADITIONAL SOLDER PASTE MANAGEMENT METHOD

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Difficulties in Traditional Solder Paste Management:

Quality assurance

  • The process does not scan the code and does not execute., how retroactive data?
  • How to check the solder paste life cycle?
  • Storage temperature of solder paste and intermediate process, Time, Personnel, Work order.How does quality data match

How to trace back

  • The process does not scan the code and does not execute., how retroactive data?
  • How to check the solder paste life cycle?
  • Storage temperature of solder paste and intermediate process, lime, Personnel, Work order.How does quality data match?

Time control

  • What should I do if I use it out of time as usual?
  • There is not enough time to warm up. What should I do if I take it out to use it?
  • If you take it out for too long, you can still take it back. What if you pass the warranty?
  • What should I do if the solder paste that has passed the warranty can be used as usual?

Temperature management

  • The storage temperature does not meet the requirements, how to avoid it?
  • The temperature recovery environment is too high or too low, how to manage it?
  • If the temperature is abnormal, how to respond to the adjustment in time?

Personnel supervision

  • How to ensure that the solder paste is not wrong?
  • How to ensure that workers manage and use solder paste in accordance with the norms?
  • How to supervise the deterioration of solder paste caused by human tactors?
  • How to ensure that the unfinished solder paste can be put back on time?

FUNCTIONAL ADVANTAGES OF INTELLIGENT SOLDER PASTE MANAGEMENT CABINET

  • Automatic code scanning - Automatic refrigeration- Solder paste reservation - Automatic rewarming - Automatic mixing
  • IC card/ingerprint/facial recognition login, strict control of personnel permissions
  • There is no limit to the type of solder paste, with first in, first out and automatic first out for half a bottle of solder paste
  • Solder paste/glue can be associated with the wire and product, and can be used to generate reports
  • 365 days *24 hours monitoring of products in the cabinet, low inventory warning
  • Tracing storage/reheating/stirring/receiving through solder paste barcode, Personnel/Time/Temperature/Work Order/Product
  • Real time inventory, full process traceability, and docking with MES/ERP and other systems

VALE OF U ASIS

  • 24 hours a day No one looks at you
  • On-si te storage/Linchuan simultaneous management
  • Track the solder paste Position and usage
  • Reduce the risk of solder paste shortage
  • Reduced solder paste stock occupancy
  • Lift the solder paste tube Quality worker
  • Leave out the receipt for Deposit and fill in the doouments
  • Reduce check costs to find matches solder Paste time
  • Ruit with first Solder paste reserve For village resumption
  • Uto tin pipe is wrong domain protection theft chuan
  • generation deal with Uncontrollable causes
  • Clear tin fit service Track farmers
  • Reduce retention
  • Optimize the fiow root of production requisition
  • Enhance the image of enterprise bone

PRODUCT TECHNICAL PARAMETERS TABLE

Serial Eqipment model Refnigeration quantity Number of reheats Mixing method Eqipment size mm Eqipment attack rate Eqipment weight Packging method
1 SN-30 30 5 Automatic L1100xD900xH2000 2500W 1000KG 500g bottled solder paste
2 SN-165 165 40 Automatic L1520xD1550xH2000 3000W 1200KG 500g bottled solder paste
3 SN-330 330 67 Automatic L1920xD1550xH2000 4000W 1550KG 500g bottled solder paste
4 SN-600 624 104 Automatic L2470xD1865xH2400 6500W 2200KG 500g bottled solder paste
5 SN-HZ100 70
225
15
70
Automatic
Not Required
L1860xD1490xH2000 4000W 1550KG 500g bottled solder paste
100g bottled solder paste
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