Mounting capability:120,000CPH Placement accuracy(3σ):±0.015mm Applicable component:0201mm-W55xL100mm T30mm
Mounting capability:115,000CPH Placement accuracy(3σ):±0.025mm Applicable component:0201mm-W55xL100 T30mm
Mounting capability:52,000CPH Placement accuracy(3σ):±0.035mm Applicable component:0201mm-W55xL100 T15mm
Mounting capability:200,00CPH Placement accuracy(3σ):±0.025mm Applicable component:0201mm-W45xL60 T15mm
Mounting capability:95,000CPH Placement accuracy(3σ):±0.025mm Applicable component:0201mm-W55xL100 T28mm
Mounting capability:81,000CPH Placement accuracy(3σ):±0.025mm Applicable component:0201mm-W55xL100 T28mm
Mounting capability:46,000CPH Placement accuracy(3σ):±0.035mm(±0.025mm)※ Applicable component:03015mm-W55xL100 T15mm
Mounting capability:10,800CPH Mounting accuracy(3σ):±15μm Wafer supply:8 inch or smaller
Printing heads:3S head Applicable PCB:Single lane : L510 x W510mm to L50 x W50mm Printing accuracy:Positioning repeatdbility (±6σ) : ±8 μm Cp≧2.0
Cycle time※:10sec Positioning repeatability(6σ):±0.01mm Printing head:3S head/Double squeegee head
Cycle time※:13.5sec Positioning repeatability(6σ):±0.01mm Printing head:3S head/Double squeegee head
Dispensing tact:0.07sec/shot Dispensing accracy(μ+3σ):±0.05mm Dispense method:Air pulsemethod
Image capturing system:2D+3D Resolution(selectable):25/12.5μm or 20/10μm or 15/7.5μm or 10/5μm or 8/4μm Application:Solder Paste Inspection(SPI)
Image capturing system:2D+3D+4Direction angle camera Resolution(selectable):12μm or 7μm or 5μm Application:Optical Inspection(AOI)
Image capturing system:2D+3D+4Ddirection angular camera Resolution(selectable):12μm or 7μm Application:Optical Inspection(AOI)
Intelligent SMD Storage System
IoT/M2M Integration system
M2M communication standard for smart factories