Ultimate Flexibility to realize 3D MID* Placement
- Enhancement to 3D MID
- Large board handling capability
- Wide ranging component handling capability and high feeder capacity
- Ultimate flexibility and fast & easy setup
※ 3D MID: Molded Interconnect Device
Function and Feature
Realize a hybrid process of mount and dispensing
New head unit for higher speed placement
Long board handling capability
Max. feeder capacity 180 lanes
Recommend for Such Production Site
For customers who want a cost-effective yet super-flexible machine
Even though an entry model, it has high flexibility, basic functions and also proves an ideal multi-purpose machine for high-speed lines.
Achieves superior conveyor performance with enhanced PCB handling Multi-Conveyor System.
- Handles PCBs from L50xW30xT0.4mm to L955(S10)/L1,455(S20)xW510xT5.0mm with 4kg weight as standard feature (can handle 20kg or more by special order).
- Input and output buffer conveyor system is standard equipment, and auto selection of optimal conveyor settings is made according to PCB size.
- Laser sensor on head unit eliminates need for mechanical PCB stoppers. Automatically provides optimal PCB position regardless of size or shape even for cut-out PCBs.
Standard specifications allow handling nearly all component recognition processes.
- Handles from 0402mm to 120x90mm components with a standard camera (OP 0201mm onwards). Can place any component without having to worry about its specifications.
- Rear multi-scan camera (OP) ensures highly efficient component placement
Feeder banks can be freely arranged to match needs
- Maximum feeder capacity of 90 types (S10)/180 types (S20) + simultaneously accommodates two (S10)/four (S20) JEDEC tray types. (when all 45-lane feeder banks+RTS-1 are selected. During 8mm tape feeder conversion)
- Full range of retrofit kits allows changing from fixed feeder banks to feeder carriages/tray feeders; or feeder carriages/tray feeders to fixed feeder banks.
- Allows freely selecting different front/rear and left/right bank configurations according to production needs and budget.
- The CTF-36C can dock with each of the M10/M20 and S10/S20 in the same way as the CFB-36E/CFB-45E.
High-speed multi-purpose head and hybrid head meet a wide range of production needs.
- Can handle component heights up to 30mm Remark : Conveyor surface reference including PCB thickness
- Real-time force control function as standard feature, also capable of reducing stress on components and handling component insertion.
- PCB warp detection function as standard, automatic control of component release height during placement
- Wide FOV fiducial camera comes as a standard feature, capable of work recognition via optimal color element according to the work piece （fiducial marks and mounted components).
- One dispenser head (OP) can be installed per placement nozzle as needed as a hybrid head for repetitive hybrid dispensing and mounting processes.
For customers who want to look at SMT line dedicated to R & D production
Ideal for dedicated prototype production machines for improving the operating rate on main SMT lines
Reduces the setup/changeover time.
- Maximum feeder capacity of 90 types (S10)/180 types (S20) + simultaneously accommodates two (S10)/four (S20) JEDEC tray types. (when all 45-lane feeder banks+RTS-1 are selected. During 8mm tape feeder conversion)
- Easy exchange to/from tray changer (CTF-36C) to/from the feeder carriage (CFB-36E/CFB-45E)
- Auto Nozzle Changer (ANC) with 24 holes available comes as a standard feature, and also ANC with 40 holes available as option to support further a wide range of components.
- Effective for prototype PCBs and high-mix low-volume production. Relocatability function (OP of Intelligent Feeder) for feeders and trays eliminates need for component supply position management.
Superb all-in-one functions make it usable as a single stand-alone machine
- Maximum feeder capacity of 90 types (S10)/180 types (S20) + simultaneously accommodates two (S10)/four (S20) JEDEC tray types. (when all 45-lane feeder banks+RTS-1 are selected. During 8mm tape feeder conversion)
- A wide range of components from 0402mm (OP 0201mm onwards) to 120x90mmxT30mm* can be handled as standard. Remark : Conveyor surface reference including PCB thickness
- Real-time force control function as standard feature, also capable of reducing stress on components and handling component insertion.
- PCB warp detection function as standard, automatic control of component release height during placement
- Auto Nozzle Changer (ANC) with 24 holes available as standard equipment, and also ANC with 40 holes as a option. Ideal for handling a variety of component types while changing nozzles
Various functions make it simple to create data
- iQvision(OP): Recognizes super-wide odd-shaped components that are difficult to handle by standard recognition.
- Wide FOV color FID camera: Reliable recognition of mounted components
- Data creation support function for tray component pickup position with multiple-image capture around the center
- Dispensing program: This can be created by batch conversion from placement program - Can be managed as single program with same cycle as placement program
Supports cost-cutting for prototype products.
- Auto-generation of dispensing program from Gerber data for metal stencils. This eliminates the cost of making metal stencils with dispensing-printing functions and that therefore do not need metal stencils.
- Dispensed dot inspection function (special order) that guarantees the quality of the dispensing function
- Handles a wide range of stick components; Simple general-purpose stick component tracks are supplied as standard accessories for the stick feeder.
For customers who want to manufacture LED lighting PCBs
Dozens of functions allow manufacturing high-quality LED lighting PCBs at a low investment
Handles long size and heavy-weight PCBs.
- Handles PCB lengths up to L1,330m(S10)/1,830mm(S20) as option; comes with warped PCB transfer guide function that prevents transfer errors at conveyor entrance.
- Capable of handling PCB weight 4kg (standard) and 20kg or more (special orders) even including a PCB carrier.
- Rigid PCB supporting by double-sided clamping of top side and bottom side PCB edge surface
- Laser sensor on head unit eliminates need for mechanical PCB stoppers. Cut-out PCBs can be freely positioned at a desired point with the PCB edge setting. No impact stopping needed even for heavy PCBs.
Handles a variety of LED components with freely configurable feeder bank.
- Interface kit is available (standard OP) that allows connecting to feeders (ball feeders, etc.) made by other manufacturers.
- A full range of retrofit kits allowing changing the feeder bank layout
Heads and nozzles ideal for LED chip placement are selectable.
- Select from high-speed multi-purpose heads for mounting LED chips, and hybrid heads ideal for mounting LED lens covers.
- Laser PCB warp detection comes as a standard feature, automatic controlling of component release height during placement even for warped PCBs
- A wide FOV fiducial camera as standard feature, capable of work recognition with optimal color element according to work piece（fiducial marks and placed components).
- A wide range of semi-standard LED nozzles are available for mounting LED chips having a variety of shapes.
Equipped with functions to support high-quality LED lighting PCB production
- LED rank management function allows setting placement by rank condition (special order).
- Adhesive dispensing program for hybrid dispenser functions can be automatically generated by batch conversion from component placement programs.
Hybrid production processes
True super-flexibility with everything the user “wants” clustered into a single unit that allows running the following processes
Hybrid dispenser function that carries out mounting and dispensing in a single cycle
- A maximum of 4 dispense heads can be installed.
- Mixed head configuration for mounting and dispensing allows running the dispensing->mounting-> dispensing-> mounting processes on a single unit.
- Utilizes a non-contact dispensing system and line dispensing function as a standard feature.
- Screw pump type dispenser: For high-speed micro-dot dispensing providing fine dispensing-volume control
- Air pulse type dispenser: For general-purpose dispensing that handles a wide range of dispensing materials and dot sizes
Mounting functions for hybrid processes
- Maximum 30mm height (component + PCB) can be achieved with the hybrid head which is also ideal for POP processes with height requirements.
- Hybrid heads with 30mm head pitch do not bind or interfere with each other even during line dispensing and large-size shield cover mounting in the same process.
Various types of special order functions to support hybrid processes
- Post dispensing inspection function guarantees an ample dispensing effect (special orders)
- Dispense nozzle tip cleaning function (special order) prevents the dispense material from dripping during the production process.
- 3D mounting function (special order) is capable of dispensing and mounting onto 3D objects.
Viedo
Feature
3D hybrid placement functions
Dispense heads that can be exchanged with mount heads are newly developed. It becomes possible to make 3D placement where solder paste dispensing and component mounting can be alternately performed. Hybrid placement is now realized. The removable Dot Station can be fitted to the feeder bank.
High-end (Screw pump type)
Standard (Air pulse type) with twin nozzle
Enhancement to 3D MID
3D MID mounting (*Custom-order specification)
Newly developed models for which dispense and placement not only on standard PCB but also on concave-convex, tilting and curved surface are also to be realized. To ensure the machine for 3D MID applications such as automotive, medical and telecommunications in future, machine structures required have already been arranged accordingly.
D MID material by JOHNAN CORPORATION SANKYO KASEI CORPORATION
Large board handling capability
Multi-Conveyor system
Utilizing a laser sensor to measure the board length, providing optimum board position for efficient component placement, regardless of size or shape, for various production styles.
Long board handling capability
Maximum length of one-time clamp : 1,240mm
| With buffer unused | With input or output buffer used | With input and output buffers used | |
|---|---|---|---|
| S10 board size |
Min. L50 x W30～ Max. L955 x W510mm（standard） |
Min. L50 x W30～ Max. L420 x W510mm |
Min. L50 x W30～ Max. L330 x W510mm |
| S20 board size |
Min. L50 x W30〜 Max. L1,455 x W510mm（standard） |
Min. L50 x W30〜 Max. L540 x W510mm |
Wide ranging component handling capability and high feeder capacity
Max. feeder capacity 180 lanes
S20 : S20 Max. 180 types(8mm tape conversion), 45 lanes x 4
S10 : S10 Max. 90 types (8mm tape conversion), 45 lanes x 2
ANC station
Nozzle ID automatically recognized. The standard ANC station can accommodate 24 nozzles. As a variation, an optional ANC station that can accommodate 40 nozzles is also available.
Wide ranging component handling capability
0201mm ultra-tiny chip (option) up to max. 120 x 90mm components can be handled by a single standard camera. Max. component height is 30mm (component height + board thickness), the greatest class on the market.
Color fiducial camera
Great upgrades in fiducial recognition performance! These include colorizing for fiducial recognition cameras and a newly developed lighting unit. Robust coating inspections are now a reality. (To be customized)
New head unit for higher speed placement
12-axis 2-theta head unit
Newly developed for higher speed placement is best suited for a long board production such as LED lighting.
6-axis 2-theta head unit
The 6-axis 2-theta head ideal for hybrid mounting tasks achieves the ultimate 1-head solution for mounters covering the process from dispensing to mounting to inspection.
Ultimate flexibility and fast & easy setup
CFB/CTF full compatibility
The newly developed CFB-45E as well as the existing CFB’s and CTF can be all used together on the M10 and M20 as well as on the S10 and S20.
Applicable CFB and CTF
- F3 45-lane Feeder Bank Changer “CFB-45E”
- F3 36-lane Feeder Bank Changer “CFB-36E”
- Changeable Tray Feeder “CTF-36C”
CFB-45E + CFB-36E
CFB-45E + CTF-36C
※Fitted to S20 on the pictures below.
Options
- 6 axis 2-theta head
- Air pulse type dispense head
- Screw pump type dispense head
- ANC40
- 0201mm chip handling capability
- Dispensed dot check function(To be customized)
- 3D-MID
- Rear fixed multi-scan camera
- F3 / F1 / F2 Rear side fixed feeder bank
- F3 45-lane fixed feeder bank
- Safety cover, front/rear
- Clamp unit for CFB/CTF
- CFB-36E / CFB-45E F3 Electric Feeder Bank Changer
- CTF-36C Cassette type Changeable Tray Feeder
- FTF-36C Cassette type Fixed Tray Feeder
- RTS-1 Removable Tray Station
- Parts feeders
- Rear side operation system
- Rear side switches
- UPS4
- Conveyor extension, entrance/exit
- Component setup verifier
- Feeder relocatability
- Waste tape box
- Internal lighting
- Lead coplanarity sensor
- Offline software
- iQvision
Specifications, External dimension
Specifications
| Model | S10 | S20 |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
※1：Board thickness + Component height = Max 30mm
Specifications and appearance are subject to change without prior notice.
External dimension
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