Yamaha proprietary hybrid placer, best suitable for module device, that consists of semiconductor and SMD.
- Hybrid mounting
Realize mixed mounting of semiconductor and SMD - High-speed and high-accuracy mounting
±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions - Upgraded component supply
Intelligent feeder - Handling Large PCBs
L330 x W250mm
Viedo
Feature
Mixed mounting of semiconductor and SMD
It is capable of various types of the production process, and YRH10 realizes SMT for semiconductor, SMD in one unit. Post-mounting inspection is provided as a standard feature.
Supply patterns
Pin transfer of adhesives (option)
Example of module component packaging process
Dipping station
Dipping pins
Pallet types
Wafer pallets (standard)
6inch wafer pallet
8inch wafer pallet
Waffle tray pallets (custom order)
2inch waffle tray pallet
Maximum settable number of
pallets : 9
4inch waffle tray pallet
Maximum settable number of
pallets : 4
High-speed and high-accuracy mounting
Placer with 10-nozzles on the mounting head realizes high productivity while maintaining high-level mounting accuracy.
Inline head with a scan camera
High-speed flexible head covers from super-tiny components to middle size odd-shaped components. The adoption of a scan camera makes the operation distance from pickup to mounting shortest, which achieves high productivity.
Scan camera
Head
Multiple Accuracy Compensation System (MACS)
New compensation function + high-accuracy positioning
Yamaha proprietary Compensation System realizes high mounting accuracy of ±15μm (μ+3σ).
Available for intelligent feeder and various options
Available for intelligent feeder which improves the pickup accuracy for tape reel component. Combining with the Multiple Accuracy Compensation System MACS realizes high-accuracy component pickup and mounting.
ZS feeder
ZS feeder
Available for electric intelligent feeder which are also used for machine. Compact and light-weight feeders improve the workability and reduces burdens to operators.
Auto Loading Feeder
An Auto Loading Feeder for which two reels can be set in advance is also supported. This type eliminates the need for splicing and can vary the supply timing. This significantly reduces the decrease in the operating rate due to running out of components.
Various options
Nozzle station
Make automatic replacements of
special and spare nozzles.
Available for nozzles stations, blow stations, and other options for various applications.
Applicable for various production processes
Customizable for various production layouts based on product types. The highly productive flexible placer contributes to realizing highly efficient production processes.
Standard layout
- Rear：YWF wafer supply unit
- Front：Feeder (24 in-line plate) x2
For power modules (custom-order layout)
- Rear：YWF wafer supply unit
- Front：Solder cutter x2
For MEMS sensors
- Rear：YWF wafer supply unit
- Front：Feeder (24 in-line plate) + dipping station
Options
- Nozzle station
- Blow station
- PCB height measurement laser sensor and nozzle height compensation touch sensor
- Multi camera (A complete set for the front is available as an option,field of view : 20mm)
- Ionizer (tape feeder side and wafer side)
- IT option available
- YSUP supported
- UPS
- Dipping station
Specifications, External dimension
Specifications
| Model | i-Cube10 (YRH10) | |
|---|---|---|
| Applicable PCB | L50 x W30mm to L330 x W250mm | |
| PCB thickness | 0.1 to 4.0mm | |
| PCB conveyance direction | Left ⇒ Right (option : Right ⇒ Left) | |
| Conveyer reference | Front | |
| Mounting accuracy (Cpk≧1.0) | ±15μm | |
| Mounting capability | 10,800 CPH (when die is supplied from wafer) Note : under optimum conditions | |
| Number of component types | Reel : Max. 48 types (conversion for 8mm tape feeder)
Wafer : Max. 10 types |
|
| Die | Die size | □0.35 to □16mm※ |
| Die thickness | 0.1 to 0.5mm※ | |
| Wafer size | 6 to 8 inch wafers, 2 to 4 inch waffle trays | |
| Wafer magazine | Wafer : Max. 10 types | |
| SMD | Component size | 0201 to □16mm, H15mm (multi camera) 0201 to □12mm, H6.5mm (scan camera) |
| Tape size | 8 to 104mm | |
| Max feeder count | Max. 48 types (for 8mm feeder) | |
| Power supply | 3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz | |
| Air supply source | 0.45 MPa or more, in clean, dry state | |
| External dimension | L1,252 x W1,962 x H1,853mm | |
| Weight | Approx. 1,560kg | |
※:The minimum size should be checked on an actual machine.
Specifications
and appearance are subject to change without prior notice.
External dimension
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