SPG
Semiconductor packaging application provides customers with equipment for the production of semiconductor packaging, high-precision solder paste printing, 3D six-sided visual inspection, X-ray inspection and dispensing coating, etc. The semiconductor packaging application department has a high-level application and technical support team. There are many senior technical engineers and professional maintenance engineers in the country, which can provide professional services and technical support to customers in Taiwan, China, and other places.
- Flip Chip Bonder &
Hybrid Placer - Solder-Paste Printer
- 3D AOI
- Reflow
- Coating
- X-Ray
- Smart Profiling
- KIC Smart Automation
- Automatic Stencil Inspection Machine
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