ZEUS

3D Wafer Bump &
Wire Bonding AOI Inspection system

  • Highest quality 3D Wire-Inspection.
  • With high-resolution, complete inspection is possible even for Foot-shape.
  • Inspect Mirror-surface without Reflection problem.
  • As for PEMTRON'S unique optical technology, Coaxial lighting was applied to 3D installation.
  • All Packages including SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
  • AOI + SPI Multi-Hybrid System.
  • With high resolution quality, inspection of small and dense parts such as Bump, Mini LED, parts lower than 009004, etc. are optimized.

Video

Technology and Feature

ZEUS was created on the basis of innovative 3D vision technology from PEMTRON as well as 15 years of experience that has enable us to lead the semiconductor industry.
The experience and knowledge we have and our understanding of these kinds technology have resulted in a focus on the semiconductor industry in which we show the highest quality, performance and technology.

The Best 3D wire Bonding AOI Inspection System

Inspection Capability

Wire Missing
Wire Lift
No Bond
Offset Wire Bond
Wire Broken
Damage
Loop Height
Wire Down
Wire Bridge
Cut Wire

The Best 3D Inspection System for advanced Packing

ZEUS is an inspection-optimized system which uses Moier technology paired with PEMTRON’s own advanced optical technology.

High accuracy die inspection without problem due to reflection

Main feature

Die inspection

- Reflective die surface inspection

- Integrated inspection review and analysis

3D inspection Capability

- Clear resolution

- Optimized image processing & algorithms

Applicable packaging

- SIP/FCBGA/FOWLP/FOPLP/WLCSP

High accuracy die inspection without problem due to reflection

AOI + SPI Multi-Hybrid System

Small component (>008004) inspection

Integrated inspection review and analysis

Ture 3D inspection capability

Optimized image processing & algorithms

High speed CPU and image processing


Small component inspection

Solving your inspection challenge with superior innovation

Specification

Standard Specification
Camera 12 Mega Pixel 12 Mega Pixel 12 Mega Pixel 12 Mega Pixel
Resolution 10um 5.5um 2.3um 1.1um
3D Light 10-Way Projection 10-Way Projection 10-Way Projection 10-Way Projection
2D Light 3 set RGB Light 3 set RGB + Coaxial Light 3 set RGB + Coaxial Light 3 set RGB + Coaxial Light
FOV 43 x 31mm 23 x 17mm 10 x 7mm 4.5 x 3.5mm
Speed 24.94 c㎡ /sec 7.82 c㎡ /sec 1.3 c㎡ /sec 0.3 c㎡ /sec
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